RESEARCH & DEVELOPMENT
Nippon Steel will expand the frontiers of steel and create the future
No.117 Special Issue on New Materials
December 2017
Contents
Preface
Technical Report
- High-performance
Bonding Wires for Semiconductor Packaging
Tomohiro UNO, Tetsuya OYAMADA, Takashi YAMADA, Taizo ODA(2.9MB) - Bonding Technique
for Power Semiconductors Using Ni Nanoparticles
Norie MATSUBARA, Tomohiro UNO, Masayuki CHIBA, Takayuki SHIMIZU(2.9MB) - Development of Newly
Advanced Metal Substrates for Catalytic Converters
Toru INAGUMA, Shogo KONYA, Yasuhiro TSUMURA, Masafumi OMIZU, Shinji KAWASOE, Masayuki KASUYA(5.2MB) - Mechanical and
Forming Properties of LAMINELITETM, Laminated Stainless Steel Foil for Battery
Packaging
Masaharu IBARAGI, Koichi NOSE, Hiroto UNNO, Naoki FUJIMOTO, Masahiro FUKUDA(3MB) - Fabrication of
Planarized Stainless Steel Foil for Flexible Substrate
Noriko YAMADA, Sawako YAMAGUCHI, Jun NAKATSUKA, Yoshiaki HAGIWARA, Yutaka SEKIGUCHI(3.4MB) - Development of New
Reinforcement Method and 10T Magnetization of QMGTM Magnet
Mitsuru MORITA, Hidekazu TESHIMA, Shinya NARIKI(5.3MB) - Spherical
SiO2 Filler for Semiconductor Sealing Materials
Yutaka SATO, Katsumasa YAGI, Mutsuhito TANAKA, Masanori AE, Syouzou TOKUDA(1.9MB) - Development of High
Quality 4H-SiC Single Crystal Wafers Grown by Solution Growth Technique
Kazuhiko KUSUNOKI, Kazuaki SEKI, Yutaka KISHIDA, Koji MORIGUCHI, Hiroshi KAIDO, Nobuhiro OKADA, Kazuhito KAMEI(2.9MB) - Computational
Materials Science for Developing Sophisticated Top Seeded Solution Growth (TSSG) Processes of Single
Crystalline SiC
Koji MORIGUCHI, Nobuhiro OKADA, Hiroshi KAIDO, Yutaka KISHIDA, Kazuhiko KUSUNOKI, Kazuaki SEKI, Kazuhito KAMEI(5.3MB)